Patent Assignment
Reel/Frame 050586/0592
Assignment of Assignor's Interest
Recorded: 2019-10-01
Pages: 5
Assignors
YU, CHEN-HUA
Executed: 2019-09-17
YEH, SUNG-FENG
Executed: 2019-09-17
CHEN, MING-FA
Executed: 2019-09-17
Assignee
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
8, LI-HSIN RD. 6, HSINCHU SCIENCE PARK, HSINCHU, 300-78, TAIWAN
Covered Property
(1)
System Formed Through Package-In-Package Formation