IP Library › Assignment 050593/0629
Patent Assignment
Reel/Frame 050593/0629

Assignment of Assignor's Interest

Recorded: 2019-10-02 Pages: 2
Assignor
Assignee
TOYOTA JIDOSHA KABUSHIKI KAISHA
1, TOYOTA-CHO, TOYOTA-SHI, AICHI-KEN, 471-8571, JAPAN
Covered Property (1)
Method of Etching Microelectronic Mechanical System Features in a Silicon Wafer
Application: 15/919,889 →
Publication: US 2019/0287810
Related Assignments (3)
Other recorded transfers of the patent in this record — the chain of ownership.
Assignment of Assignor's Interest Mar 13, 2018
From: ZHOU, FENG; DEDE, ERCAN MEHMET
To: TOYOTA MOTOR ENGINEERING & MANUFACTURING NORTH AMERICA, INC.
Reel/Frame 045190/0514 →
Assignment of Assignor's Interest Mar 13, 2018
From: ASHEGHI, MEHDI; JUNG, KI WOOK; GOODSON, KENNETH E.
To: THE BOARD OF TRUSTEES OF THE LELAND STANFORD JUNIOR UNIVERSITY
Reel/Frame 045190/0778 →
Assignment of Assignor's Interest Nov 24, 2021
From: TOYOTA JIDOSHA KABUSHIKI KAISHA
To: DENSO CORPORATION
Reel/Frame 058241/0924 →