Patent Assignment
Reel/Frame 050603/0497
Assignment of Assignor's Interest
Recorded: 2019-10-02
Pages: 6
Assignors
STRONG, VERONICA
Executed: 2019-09-17
ALEKSOV, ALEKSANDAR
Executed: 2019-09-16
BRAUNISCH, HENNING
Executed: 2019-09-16
RAWLINGS, BRANDON
Executed: 2019-09-16
SWAN, JOHANNA
Executed: 2019-09-16
LIFF, SHAWNA
Executed: 2019-09-16
Assignee
INTEL CORPORATION
2200 MISSION COLLEGE BLVD., SANTA CLARA, CALIFORNIA, 95054
Covered Property
(1)
High-Density Interconnects for Integrated Circuit Packages