Patent Assignment
Reel/Frame 050605/0266
Assignment of Assignor's Interest
Recorded: 2019-10-02
Pages: 3
Assignee
KOKUSAI ELECTRIC CORPORATION
3-4, KANDAKAJI-CHO, CHIYODA-KU, TOKYO, 1010045, JAPAN
Covered Property
(1)
Substrate Processing Apparatus and Method of Manufacturing Semiconductor Device