Patent Assignment
Reel/Frame 050605/0405
Assignment of Assignor's Interest
Recorded: 2019-10-02
Pages: 3
Assignee
SK HYNIX INC.
2091, GYEONGCHUNG-DAERO, BUBAL-EUB, ICHEON-SI GYEONGGI-DO, KOREA, REPUBLIC OF
Covered Property
(1)
Stack Semiconductor Packages Having Wire-Bonding Connection Structure
Related Assignments
(1)
Other recorded transfers of the patent in this record — the chain of ownership.