Patent Assignment
Reel/Frame 050609/0714
Assignment of Assignor's Interest
Recorded: 2019-10-03
Pages: 4
Assignors
CHEN, MING-FA
Executed: 2019-09-10
YEH, SUNG-FENG
Executed: 2019-09-10
LIU, TZUAN-HORNG
Executed: 2019-09-10
SHIH, CHAO-WEN
Executed: 2019-09-10
Assignee
TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
NO.8, LI-HSIN RD. 6, HSINCHU SCIENCE PARK,, HSINCHU, 300-78, TAIWAN
Covered Property
(1)
Stacking Structure, Package Structure and Method of Fabricating the Same