Patent Assignment
Reel/Frame 050615/0454
Assignment of Assignor's Interest
Recorded: 2019-10-03
Pages: 3
Assignors
CHENG, YUN-WEI
Executed: 2019-09-17
CHOU, CHUN-HAO
Executed: 2019-09-17
LEE, KUO-CHENG
Executed: 2019-09-17
CHEN, YING-HAO
Executed: 2019-09-20
CHIA, CHUN-WEI
Executed: 2019-09-17
Assignee
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
NO. 8, LI-HSIN RD. VI, HSINCHU SCIENCE PARK, HSINCHU, 300, TAIWAN
Covered Property
(1)
Image Sensor Having Stress Releasing Structure and Method of Forming Same