Patent Assignment
Reel/Frame 050616/0296
Assignment of Assignor's Interest
Recorded: 2019-10-03
Pages: 2
Assignors
PENG, SHIH-WEI
Executed: 2019-09-17
TZENG, JIANN-TYNG
Executed: 2019-09-17
LIN, WEI-CHENG
Executed: 2019-09-17
Assignee
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
NO. 8, LI-HSIN RD. VI, HSINCHU SCIENCE PARK, HSINCHU, 300, TAIWAN
Covered Property
(1)
Semiconductor Structure, Device, and Method