Patent Assignment
Reel/Frame 050635/0426
Assignment of Assignor's Interest
Recorded: 2019-10-07
Pages: 4
Assignor
DOORNBOS, GERBEN
Executed: 2019-09-19
Assignee
TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
NO. 8, LI-HSIN RD. 6, SCIENCE BASED INDUSTRIAL PARK, HSINCHU, 300, TAIWAN
Covered Property
(1)
Semiconductor Device Including Back Side Power Supply Circuit