Patent Assignment
Reel/Frame 050638/0422
Assignment of Assignor's Interest
Recorded: 2019-10-07
Pages: 4
Assignors
HUANG, WEI-CHIEH
Executed: 2018-01-19
CHEN, JIEH-JANG
Executed: 2018-01-23
SHIU, FENG-JIA
Executed: 2018-01-19
HSU, CHERN-YOW
Executed: 2018-01-23
Assignee
TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
8, LI-HSIN RD. 6, HSINCHU SCIENCE PARK, HSINCHU, 300-78, TAIWAN
Covered Property
(1)
Via Structure and Methods of Forming the Same