Patent Assignment
Reel/Frame 050643/0804
Assignment of Assignor's Interest
Recorded: 2019-10-07
Pages: 5
Assignors
KIM, HAK-SUNG
Executed: 2019-10-07
OH, GYUNG HWAN
Executed: 2019-10-07
KIM, DEOK JOONG
Executed: 2019-10-07
PARK, DONG WOON
Executed: 2019-10-07
Assignee
IUCF-HYU (INDUSTRY-UNIVERSITY COOPERATION FOUNDATION HANYANG UNIVERSITY)
222, WANGSIMNI-RO, SEONGDONG-GU, SEOUL, 04763, KOREA, REPUBLIC OF
Covered Property
(1)
Thickness Measurement Apparatus, Thickness Measurement Method, and Thickness Measurement Program
Related Assignments
(1)
Other recorded transfers of the patent in this record — the chain of ownership.