Patent Assignment
Reel/Frame 050644/0292
Assignment of Assignor's Interest
Recorded: 2019-10-07
Pages: 4
Assignors
PAO, YI-CHING
Executed: 2019-10-03
PAO, JAMES
Executed: 2019-10-03
RIAZIAT, MAJID
Executed: 2019-10-03
WU, TA-CHUNG
Executed: 2019-10-03
Assignee
OEPIC SEMICONDUCTORS, INC.
1231 BORDEAUX DRIVE, SUNNYVALE, CALIFORNIA, 94089
Covered Property
(1)
Planarization and Flip-Chip Fabrication Process of Fine-Line-Geometry Features with High-Roughness Metal-Alloyed Surfaces
Related Assignments
(3)
Other recorded transfers of the patent in this record — the chain of ownership.
Assignment of Assignor's Interest
Nov 14, 2023
From: OEPIC SEMICONDUCTORS, INC
To: FOR PATENT SAFE, INC.
Reel/Frame 065557/0695 →
Corrective Assignment to Correct the Assignee Name Previously Recorded on Reel 065557 Frame 0695. Assignor(S) Hereby Confirms the for Patent Safe, Inc.
Nov 20, 2023
From: OEPIC SEMICONDUCTORS, INC
To: PATENT SAFE, INC.
Reel/Frame 065631/0185 →
Assignment of Assignor's Interest
Aug 26, 2025
From: PATENT SAFE
To: NETFORCE OELABS, INC.
Reel/Frame 072122/0485 →