Patent Assignment
Reel/Frame 050652/0592
Assignment of Assignor's Interest
Recorded: 2019-10-08
Pages: 6
Assignee
SAMSUNG ELECTRONICS CO., LTD.
129, SAMSUNG-RO, YEONGTONG-GU, SUWON-SI, GYEONGGI-DO, 16677, KOREA, REPUBLIC OF
Covered Property
(1)
Apparatus and Method of Forming Backside Buried Conductor in Integrated Circuit