Patent Assignment
Reel/Frame 050659/0255
Assignment of Assignor's Interest
Recorded: 2019-10-09
Pages: 14
Assignors
CHIU, YUNG-CHEN
Executed: 2019-10-04
HSUEH, SHENG-YUAN
Executed: 2019-10-04
LEE, KUO-HSING
Executed: 2019-10-04
WU, CHIEN-LIANG
Executed: 2019-10-04
KANG, CHIH-KAI
Executed: 2019-10-04
HUANG, GUAN-KAI
Executed: 2019-10-04
Assignee
UNITED MICROELECTRONICS CORP.
NO.3, LI-HSIN ROAD 2, SCIENCE-BASED INDUSTRIAL PARK, HSIN-CHU CITY, TAIWAN
Covered Property
(1)
3D Semiconductor Structure and Method of Fabricating the Same