Patent Assignment
Reel/Frame 050662/0868
Assignment of Assignor's Interest
Recorded: 2019-10-09
Pages: 3
Assignors
NOMURA, TAKUMI
Executed: 2019-09-20
KOBAYASHI, WATARU
Executed: 2019-09-23
KODA, KAZUKI
Executed: 2019-09-30
Assignee
DENSO CORPORATION
1-1, SHOWA-CHO, KARIYA-CITY, AICHI-PREF., 448-8661, JAPAN
Covered Property
(1)
Base Material, Mold Package, Base Material Manufacturing Method, and Mold Package Manufacturing Method