Patent Assignment
Reel/Frame 050663/0027
Assignment of Assignor's Interest
Recorded: 2019-10-09
Pages: 4
Assignors
KUNG, CHUN-HAO
Executed: 2019-07-17
WANG, SHANG-YU
Executed: 2019-07-17
TSAI, CHING-HSIANG
Executed: 2019-07-17
HUANG, HUI-CHI
Executed: 2019-07-17
CHEN, KEI-WEI
Executed: 2019-07-17
Assignee
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
8, LI-HSIN RD. 6, HSINCHU SCIENCE PARK, HSINCHU, 300-78, TAIWAN
Covered Property
(1)
Mega-Sonic Vibration Assisted Chemical Mechanical Planarization