Patent Assignment
Reel/Frame 050663/0691
Assignment of Assignor's Interest
Recorded: 2019-10-09
Pages: 8
Assignors
HSIEH, TE-HSIEN
Executed: 2019-09-24
CHEN, TZU-YU
Executed: 2019-09-24
TU, KUO-CHI
Executed: 2019-09-25
TSENG, YUAN-TAI
Executed: 2019-09-24
Assignee
TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
NO. 8, LI-HSIN RD. 6, HSIN-CHU SCIENCE PARK, HSIN-CHU, 300-77, TAIWAN
Covered Property
(1)
3D Rram Cell Structure for Reducing Forming and Set Voltages