Patent Assignment
Reel/Frame 050664/0286
Assignment of Assignor's Interest
Recorded: 2019-10-09
Pages: 4
Assignors
CHOI, JAE-JOON
Executed: 2019-09-18
KIM, NAM-SEONG
Executed: 2019-09-18
KIM, BYUNG-ROC
Executed: 2019-09-18
YOO, JONG-JAE
Executed: 2019-09-18
PARK, BOO-SEONG
Executed: 2019-09-18
Assignee
LASERSSEL CO., LTD.
1F, 20, HOSEO-RO 79BEON-GIL, BAEBANG-EUP, ASAN-SI, CHUNGCHEONGNAM-DO, 31499, KOREA, REPUBLIC OF
Covered Property
(1)
Multi-Beam Laser De-Bonding Apparatus and Method Thereof