Patent Assignment
Reel/Frame 050679/0567
Assignment of Assignor's Interest
Recorded: 2019-10-10
Pages: 3
Assignor
MACHEINER, STEFAN
Executed: 2019-10-07
Assignee
INFINEON TECHNOLOGIES AG
AM CAMPEON 1-15, NEUBIBERG, 85579, GERMANY
Covered Property
(1)
Semiconductor Package with Top or Bottom Side Cooling and Method for Manufacturing the Semiconductor Package