Patent Assignment
Reel/Frame 050681/0616
Assignment of Assignor's Interest
Recorded: 2019-10-10
Pages: 3
Assignors
VREELAND, RICHARD
Executed: 2019-10-09
CARVER, COLIN
Executed: 2019-10-09
BREZINSKI, WILLIAM
Executed: 2019-10-09
CHRISTENSON, MICHAEL
Executed: 2019-10-09
KABIR, NAFEES
Executed: 2019-10-09
Assignee
INTEL CORPORATION
2200 MISSION COLLEGE BOULEVARD, SANTA CLARA, CALIFORNIA, 95054
Covered Property
(1)
Methods & Structures for Improved Electrical Contact Between Bonded Integrated Circuit Interfaces