Patent Assignment
Reel/Frame 050684/0044
Assignment of Assignor's Interest
Recorded: 2019-10-10
Pages: 4
Assignee
SHOWA DENKO K.K.
13-9, SHIBADAIMON 1-CHOME, MINATO-KU, TOKYO, 105-8518, JAPAN
Covered Property
(1)
SiC SUBSTRATE EVALUATION METHOD AND METHOD FOR MANUFACTURING SiC EPITAXIAL WAFER
Related Assignments
(2)
Other recorded transfers of the patent in this record — the chain of ownership.