Patent Assignment
Reel/Frame 050684/0570
Assignment of Assignor's Interest
Recorded: 2019-10-10
Pages: 6
Assignors
ZHOU, YUNPENG
Executed: 2019-10-08
GUO, WANLI
Executed: 2019-10-08
HU, XING
Executed: 2019-10-08
HUANG, YUHENG
Executed: 2019-10-08
Assignee
WUHAN XINXIN SEMICONDUCTOR MANUFACTURING CO., LTD.
NO. 18, GAOXIN 4TH ROAD, DONGHU DEVELOPMENT ZONE, WUHAN, HUBEI, 430205, CHINA
Covered Property
(1)
Semiconductor Wafer, Bonding Structure And Wafer Bonding Method