Patent Assignment
Reel/Frame 050689/0874
Assignment of Assignor's Interest
Recorded: 2019-10-11
Pages: 4
Assignors
LAI, YU-CHIA
Executed: 2019-09-12
HSIEH, CHENG-CHIEH
Executed: 2019-09-17
KUO, TIN-HAO
Executed: 2019-09-12
TSAI, HAO-YI
Executed: 2019-09-12
LIU, CHUNG-SHI
Executed: 2019-09-20
YU, CHEN-HUA
Executed: 2019-09-20
Assignee
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
8, LI-HSIN RD. 6, HSINCHU SCIENCE PARK, HSINCHU, 300-78, TAIWAN
Covered Property
(1)
IPD Modules with Flexible Connection Scheme in Packaging