Patent Assignment
Reel/Frame 050691/0661
Assignment of Assignor's Interest
Recorded: 2019-10-11
Pages: 3
Assignee
RENESAS ELECTRONICS CORPORATION
2-24, TOYOSU 3-CHOME, KOUTOU-KU, TOKYO, 135-0061, JAPAN
Covered Property
(1)
Semiconductor Module and Method of Manufacturing the Same, and Method of Communication Using the Same