Patent Assignment
Reel/Frame 050693/0747
Assignment of Assignor's Interest
Recorded: 2019-10-11
Pages: 10
Assignors
ELSHERBINI, ADEL
Executed: 2019-09-23
MORROW, PATRICK
Executed: 2019-09-25
SWAN, JOHANNA
Executed: 2019-09-26
LIFF, SHAWNA
Executed: 2019-09-23
KOBRINSKY, MAURO
Executed: 2019-09-25
LE, VAN
Executed: 2019-09-25
PASDAST, GERALD
Executed: 2019-09-25
Assignee
INTEL CORPORATION
2200 MISSION COLLEGE BLVD., SANTA CLARA, CALIFORNIA, 95054
Covered Property
(1)
Vias in Composite Ic Chip Structures