Patent Assignment
Reel/Frame 050704/0610
Assignment of Assignor's Interest
Recorded: 2019-10-14
Pages: 9
Assignors
KAO, MIN-FENG
Executed: 2016-07-26
YAUNG, DUN-NIAN
Executed: 2016-07-28
LIN, HSING-CHIH
Executed: 2016-07-26
LIU, JEN-CHENG
Executed: 2016-07-28
HUANG, KUAN-CHIEH
Executed: 2016-07-29
Assignee
TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
NO. 8, LI-HSIN RD. 6, HSIN-CHU SCIENCE PARK, HSIN-CHU, 300-77, TAIWAN
Covered Property
(1)
Integrated Circuit (Ic) Structure for High Performance and Functional Density