Patent Assignment
Reel/Frame 050712/0268
Assignment of Assignor's Interest
Recorded: 2019-10-15
Pages: 3
Assignee
RENESAS ELECTRONICS CORPORATION
2-24, TOYOSU 3-CHOME, KOUTOU-KU, TOKYO, 135-0061, JAPAN
Covered Property
(1)
Semiconductor Device and Manufacturing Method Thereof