Patent Assignment
Reel/Frame 050723/0416
Assignment of Assignor's Interest
Recorded: 2019-10-15
Pages: 4
Assignors
KATKAR, RAJESH
Executed: 2019-02-22
MIRKARIMI, LAURA WILLS
Executed: 2019-04-15
LEE, BONGSUB
Executed: 2019-02-22
FOUNTAIN, GAIUS GILLMAN, JR.
Executed: 2019-02-22
UZOH, CYPRIAN EMEKA
Executed: 2019-02-27
Assignee
INVENSAS BONDING TECHNOLOGIES, INC.
3025 ORCHARD PARKWAY, SAN JOSE, CALIFORNIA, 95134
Covered Property
(1)
Bonded Structures
Related Assignments
(3)
Other recorded transfers of the patent in this record — the chain of ownership.
Security Interest
Jun 1, 2020
From: ROVI SOLUTIONS CORPORATION; ROVI TECHNOLOGIES CORPORATION; ROVI GUIDES, INC.; TIVO SOLUTIONS INC.
To: BANK OF AMERICA, N.A.
Reel/Frame 053468/0001 →
Assignment of Assignor's Interest
Aug 16, 2023
From: KATKAR, RAJESH; MIRKARIMI, LAURA WILLS; LEE, BONGSUB; FOUNTAIN, GAIUS GILLMAN, JR.
To: INVENSAS BONDING TECHNOLOGIES, INC.
Reel/Frame 064612/0782 →
Change of Name
Oct 20, 2025
From: INVENSAS BONDING TECHNOLOGIES, INC.
To: ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC.
Reel/Frame 073173/0300 →