IP Library › Assignment 050735/0272
Patent Assignment
Reel/Frame 050735/0272

Assignment of Assignor's Interest

Recorded: 2019-10-16 Pages: 3
Assignors
SEE, GUAN HUEI
Executed: 2019-09-25
LIANTO, PRAYUDI
Executed: 2019-09-25
GU, YU
Executed: 2019-09-27
Assignee
APPLIED MATERIALS SINGAPORE TECHNOLOGY PTE. LTD.
8 UPPER CHANGI ROAD NORTH, APPLIED MATERIALS BUILDING, SINGAPORE, 506906, SINGAPORE
Covered Property (1)
Methods of Thinning Silicon on Epoxy Mold Compound for Radio Frequency (Rf) Applications
Application: 16/579,723 →
Publication: US 2021/0090905
Related Assignments (1)
Other recorded transfers of the patent in this record — the chain of ownership.
Assignment of Assignor's Interest Nov 5, 2019
From: APPLIED MATERIALS SINGAPORE TECHNOLOGY PTE. LTD.
To: APPLIED MATERIALS, INC.
Reel/Frame 050917/0604 →