Patent Assignment
Reel/Frame 050735/0560
Assignment of Assignor's Interest
Recorded: 2019-10-16
Pages: 4
Assignors
HUANG, HSIN-YEN
Executed: 2019-09-17
LEE, SHAO-KUAN
Executed: 2019-09-17
LEE, CHENG-CHIN
Executed: 2019-09-17
CHEN, HAI-CHING
Executed: 2019-09-17
SHUE, SHAU-LIN
Executed: 2019-09-17
Assignee
TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
NO. 8, LI-HSIN RD. 6, HSINCHU SCIENCE PARK, HSINCHU, 300-78, TAIWAN
Covered Property
(1)
Interconnect Structure and Method for Forming the Same