Patent Assignment
Reel/Frame 050736/0095
Assignment of Assignor's Interest
Recorded: 2019-10-16
Pages: 5
Assignors
TAN, CHIN WEI
Executed: 2019-08-26
PENG, QI JIE
Executed: 2019-08-26
LIM, FANG JIE
Executed: 2019-09-02
LIANTO, PRAYUDI
Executed: 2019-08-26
THIRUNAVUKARASU, SRISKANTHARAJAH
Executed: 2019-09-01
SUNDARRAJAN, ARVIND
Executed: 2019-09-06
SU, JUN-LIANG
Executed: 2019-08-26
Assignee
APPLIED MATERIALS SINGAPORE TECHNOLOGY PTE. LTD.
8 UPPER CHANGI ROAD NORTH, APPLIED MATERIALS BUILDING, SINGAPORE, 506906, SINGAPORE
Covered Property
(1)
Methods and Apparatus for Contactless Substrate Warpage Correction
Application:
16/545,752 →
Publication:
US 2021/0057238
Related Assignments
(1)
Other recorded transfers of the patent in this record — the chain of ownership.