Patent Assignment
Reel/Frame 050740/0288
Assignment of Assignor's Interest
Recorded: 2019-10-16
Pages: 4
Assignors
CHANG, CHIH-CHIEH
Executed: 2019-09-12
TSAI, CHUNG-HAO
Executed: 2019-09-12
YU, CHEN-HUA
Executed: 2019-09-12
WANG, CHUEI-TANG
Executed: 2019-09-12
Assignee
TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
NO.8, LI-HSIN RD. 6, HSINCHU SCIENCE PARK,, HSINCHU, 300-78, TAIWAN
Covered Property
(1)
Semiconductor Package and Manufacturing Method Thereof