Patent Assignment
Reel/Frame 050740/0315
Assignment of Assignor's Interest
Recorded: 2019-10-16
Pages: 4
Assignors
CHEN, MING-FA
Executed: 2019-09-17
YEH, SUNG-FENG
Executed: 2019-09-17
LIU, TZUAN-HORNG
Executed: 2019-09-17
SHIH, CHAO-WEN
Executed: 2019-09-17
Assignee
TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
NO.8, LI-HSIN RD. 6, HSINCHU SCIENCE PARK,, HSINCHU, 300-78, TAIWAN
Covered Property
(1)
Semiconductor Structure and Manufacturing Method Thereof