Patent Assignment
Reel/Frame 050740/0401
Assignment of Assignor's Interest
Recorded: 2019-10-16
Pages: 6
Assignors
CHEN, WEIMING CHRIS
Executed: 2019-09-20
WU, CHI-HSI
Executed: 2019-09-26
WU, CHIH-WEI
Executed: 2019-09-27
TING, KUO-CHIANG
Executed: 2019-09-20
LU, SZU-WEI
Executed: 2019-09-27
HOU, SHANG-YUN
Executed: 2019-09-26
SHIH, YING-CHING
Executed: 2019-10-01
TSOU, HSIEN-JU
Executed: 2019-10-01
LI, CHENG-CHIEH
Executed: 2019-10-01
Assignee
TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
NO.8, LI-HSIN RD. 6, HSINCHU SCIENCE PARK,, HSINCHU, 300-78, TAIWAN
Covered Property
(1)
Package Structure with a Heat Dissipating Element and Method of Manufacturing the Same