Assignment of Assignor's Interest

Recorded: 2019-10-17 Pages: 5

Assignors

MISHIMA, TOMOYOSHI

Executed: 2019-02-28

HORIKIRI, FUMIMASA

Executed: 2019-10-16

Assignees

HOSEI UNIVERSITY

2-17-1 FUJIMI, CHIYODA-KU, TOKYO, 1028160, JAPAN

SCIOCS COMPANY LIMITED

880, ISAGOZAWA-CHO, HITACHI-SHI, IBARAKI, 3191418, JAPAN

27-1, SHINKAWA 2-CHOME, CHUO-KU, TOKYO, 1048260, JAPAN

Covered Property (1)

Semiconductor Device and Method for Manufacturing the Same

Patent: 10,797,181 →

Application: 16/327,969 →

Publication: US 2019/0189808

Related Assignments (1)

Other recorded transfers of the patent in this record — the chain of ownership.