Patent Assignment
Reel/Frame 050754/0555
Assignment of Assignor's Interest
Recorded: 2019-10-17
Pages: 5
Assignors
LIU, SYU-TANG
Executed: 2019-10-17
HUANG, MIN LUNG
Executed: 2019-10-17
CHANG, HUANG-HSIEN
Executed: 2019-10-17
TSAI, TSUNG-TANG
Executed: 2019-10-17
CHEN, CHING-JU
Executed: 2019-10-17
Assignee
ADVANCED SEMICONDUCTOR ENGINEERING, INC.
26 CHIN 3RD ROAD, NANTZE EXPORT PROCESSING ZONE, KAOHSIUNG, TAIWAN
Covered Property
(1)
Package Structure, Assembly Structure and Method for Manufacturing the Same