Patent Assignment
Reel/Frame 050758/0960
Assignment of Assignor's Interest
Recorded: 2019-10-18
Pages: 2
Assignors
CHEN, HSIEN-WEI
Executed: 2019-10-01
CHEN, JIE
Executed: 2019-10-01
CHEN, MING-FA
Executed: 2019-10-07
Assignee
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
8, LI-HSIN RD. 6, HSINCHU SCIENCE PARK, HSINCHU, 300-78, TAIWAN
Covered Property
(1)
Bonding Structure and Method of Forming Same