Patent Assignment
Reel/Frame 050760/0219
Assignment of Assignor's Interest
Recorded: 2019-10-18
Pages: 4
Assignors
LIN, YI-SHENG
Executed: 2019-06-14
LIU, CHI-JEN
Executed: 2019-06-14
SHEN, CHI-HSIANG
Executed: 2019-06-14
KUNG, TE-MING
Executed: 2019-06-14
HSU, CHUN-WEI
Executed: 2019-06-14
HO, CHIA-WEI
Executed: 2019-06-14
CHENG, YANG-CHUN
Executed: 2019-06-14
HONG, WILLIAM WEILUN
Executed: 2019-06-14
CHEN, LIANG-GUANG
Executed: 2019-06-14
CHEN, KEI-WEI
Executed: 2019-06-14
Assignee
TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
8, LI-HSIN RD. 6, HSINCHU SCIENCE PARK, HSINCHU, 300-78, TAIWAN
Covered Property
(1)
Metal Heterojunction Structure with Capping Metal Layer