IP Library › Assignment 050760/0269
Patent Assignment
Reel/Frame 050760/0269

Assignment of Assignor's Interest

Recorded: 2019-10-18 Pages: 3
Assignors
CHOU, CHUNG-PIN
Executed: 2019-05-31
HUANG, SHENG-WEN
Executed: 2019-05-31
Assignee
TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
8, LI-HSIN RD. 6, HSINCHU SCIENCE PARK, HSINCHU, 300-78, TAIWAN
Covered Property (1)
Machine Learning on Wafer Defect Review
Application: 16/430,323 →
Publication: US 2020/0105500
Related Assignments (1)
Other recorded transfers of the patent in this record — the chain of ownership.
Assignment of Assignor's Interest Sep 23, 2020
From: LIU, JUN-XIU
To: TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
Reel/Frame 053862/0928 →