Patent Assignment
Reel/Frame 050760/0295
Assignment of Assignor's Interest
Recorded: 2019-10-18
Pages: 3
Assignors
VAN DAL, MARCUS JOHANNES HENRICUS
Executed: 2019-06-18
VASEN, TIMOTHY
Executed: 2019-06-19
DOORNBOS, GERBEN
Executed: 2019-06-18
Assignee
TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
8, LI-HSIN RD. 6, HSINCHU SCIENCE PARK, HSINCHU, 300-78, TAIWAN
Covered Property
(1)
Semiconductor Structure with Diffusion Break and Method