Patent Assignment
Reel/Frame 050768/0495
Assignment of Assignor's Interest
Recorded: 2019-10-19
Pages: 3
Assignor
SANUKI, TOMOYA
Executed: 2019-08-30
Assignee
TOSHIBA MEMORY CORPORATION
1-1, SHIBAURA 1-CHOME, MINATO-KU, TOKYO, 105-0023, JAPAN
Covered Property
(1)
Semiconductor Device with Bonding Pads and Method of Manufacturing the Same
Related Assignments
(1)
Other recorded transfers of the patent in this record — the chain of ownership.