Patent Assignment
Reel/Frame 050773/0869
Assignment of Assignor's Interest
Recorded: 2019-10-21
Pages: 4
Assignors
OH, YOONG
Executed: 2019-10-10
KIM, SANG-HOON
Executed: 2019-10-10
KIM, HEA-SUNG
Executed: 2019-10-10
KIM, GYU-MOOK
Executed: 2019-10-10
KO, YOUNG-KUK
Executed: 2019-10-10
Assignee
SAMSUNG ELECTRO-MECHANICS CO., LTD.
MAEYOUNG-RO 150 (MAETAN-DONG), YOUNGTONG-GU, GYEONGGI-DO, SUWON-SI, 16674, KOREA, REPUBLIC OF
Covered Property
(1)
Printed Circuit Board and Package Structure Having the Same