Patent Assignment
Reel/Frame 050776/0150
Assignment of Assignor's Interest
Recorded: 2019-10-21
Pages: 7
Assignors
LEE, HANGLIM
Executed: 2019-10-17
GOH, JUNGSUK
Executed: 2019-10-17
KIM, KWANGSUP
Executed: 2019-10-17
KIM, DOYEON
Executed: 2019-10-17
KIM, MINYOUNG
Executed: 2019-10-17
PARK, JIHOON
Executed: 2019-10-17
KIM, YUNGI
Executed: 2019-10-17
KIM, DO HEON
Executed: 2019-10-17
LEE, CHOONGHYUN
Executed: 2019-10-17
LEE, HYO SEOK
Executed: 2019-10-17
JANG, SOO ILL
Executed: 2019-10-17
Assignee
SEMES CO., LTD.
77, 4SANDAN 5-GIL, JIKSAN-EUP, SEOBUK-GU, CHEONAN-SI, CHUNGCHEONGNAM-DO, KOREA, REPUBLIC OF
Covered Property
(1)
Die Bonding Apparatus and Method and Substrate Bonding Apparatus and Method