Patent Assignment
Reel/Frame 050799/0476
Assignment of Assignor's Interest
Recorded: 2019-10-23
Pages: 3
Assignor
KIYOI, AKIRA
Executed: 2019-10-04
Assignee
MITSUBISHI ELECTRIC CORPORATION
7-3, MARUNOUCHI 2-CHOME, CHIYODA-KU, TOKYO, 100-8310, JAPAN
Covered Property
(1)
Method of Manufacturing Semiconductor Device, and Semiconductor Device