Patent Assignment
Reel/Frame 050805/0865
Assignment of Assignor's Interest
Recorded: 2019-10-23
Pages: 8
Assignors
LIN, YUSHENG
Executed: 2019-07-08
CARNEY, FRANCIS J.
Executed: 2019-07-08
CHEW, CHEE HIONG
Executed: 2019-07-08
YASUDA, SHUNSUKE
Executed: 2019-07-08
Assignee
SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
5005 E. MCDOWELL ROAD, MAILDROP A700, PHOENIX, ARIZONA, 85008
Covered Property
(1)
Pre-Stacking Mechanical Strength Enhancement of Power Device Structures
Application:
16/661,633 →
Publication:
US 2021/0013176
Related Assignments
(2)
Other recorded transfers of the patent in this record — the chain of ownership.
Security Interest
Oct 16, 2020
From: SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC; FAIRCHILD SEMICONDUCTOR CORPORATION; ON SEMICONDUCTOR CONNECTIVITY SOLUTIONS, INC.
To: DEUTSCHE BANK AG NEW YORK BRANCH, AS COLLATERAL AGENT
Reel/Frame 054090/0617 →
Release of Security Interest in Patents Recorded at Reel 054090, Frame 0617
Jun 23, 2023
From: DEUTSCHE BANK AG NEW YORK BRANCH, AS COLLATERAL AGENT
To: SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC; FAIRCHILD SEMICONDUCTOR CORPORATION
Reel/Frame 064081/0167 →