Patent Assignment
Reel/Frame 050806/0302
Assignment of Assignor's Interest
Recorded: 2019-10-23
Pages: 6
Assignors
NOMA, TAKASHI
Executed: 2019-07-10
OKUBO, NOBORU
Executed: 2019-07-10
LIN, YUSHENG
Executed: 2019-07-09
Assignee
SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
5005 E. MCDOWELL ROAD, MAILDROP A700, PHOENIX, ARIZONA, 85008
Covered Property
(1)
Solder Bump Formation Using Wafer with Ring
Related Assignments
(2)
Other recorded transfers of the patent in this record — the chain of ownership.
Security Interest
Oct 16, 2020
From: SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC; FAIRCHILD SEMICONDUCTOR CORPORATION; ON SEMICONDUCTOR CONNECTIVITY SOLUTIONS, INC.
To: DEUTSCHE BANK AG NEW YORK BRANCH, AS COLLATERAL AGENT
Reel/Frame 054090/0617 →
Release of Security Interest in Patents Recorded at Reel 054090, Frame 0617
Jun 23, 2023
From: DEUTSCHE BANK AG NEW YORK BRANCH, AS COLLATERAL AGENT
To: SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC; FAIRCHILD SEMICONDUCTOR CORPORATION
Reel/Frame 064081/0167 →