Patent Assignment
Reel/Frame 050807/0905
Assignment of Assignor's Interest
Recorded: 2019-10-23
Pages: 2
Assignor
TSUGAWA, HIDENOBU
Executed: 2019-10-11
Assignee
SONY SEMICONDUCTOR SOLUTIONS CORPORATION
4-14-1 ASAHI-CHO, ATSUGI-SHI, KANAGAWA, 243-0014, JAPAN
Covered Property
(1)
Semiconductor Device, Manufacturing Method, Imaging Element, and Electronic Device