Patent Assignment
Reel/Frame 050810/0308
Assignment of Assignor's Interest
Recorded: 2019-10-24
Pages: 3
Assignee
SAMSUNG ELECTRO-MECHANICS CO., LTD.
MAEYOUNG-RO 150 (MAETAN-DONG), YOUNGTONG-GU, GYEONGGI-DO, SUWON-SI, 16674, KOREA, REPUBLIC OF
Covered Property
(1)
Printed Circuit Board and Package Structure