Patent Assignment
Reel/Frame 050813/0911
Assignment of Assignor's Interest
Recorded: 2019-10-24
Pages: 6
Assignors
NAYINI, MANISH
Executed: 2019-10-24
GRAF, RICHARD S.
Executed: 2019-10-23
PATEL, JANAK G.
Executed: 2019-10-23
HABIB, NAZMUL
Executed: 2019-10-23
Assignee
GLOBALFOUNDRIES INC.
P.O. BOX 309, UGLAND HOUSE, GRAND CAYMAN, KY1-1104, CAYMAN ISLANDS
Covered Property
(1)
Ic Chip Package with Dummy Solder Structure Under Corner, and Related Method
Related Assignments
(4)
Other recorded transfers of the patent in this record — the chain of ownership.
Assignment of Assignor's Interest
Nov 20, 2019
From: GLOBALFOUNDRIES, INC.
To: MARVELL INTERNATIONAL LTD.
Reel/Frame 051061/0681 →
Assignment of Assignor's Interest
Dec 10, 2019
From: GLOBALFOUNDRIES, INC.
To: MARVELL INTERNATIONAL LTD.
Reel/Frame 051229/0096 →
Assignment of Assignor's Interest
Oct 6, 2020
From: MARVELL INTERNATIONAL LTD.
To: CAVIUM INTERNATIONAL
Reel/Frame 053987/0949 →
Assignment of Assignor's Interest
Oct 6, 2020
From: CAVIUM INTERNATIONAL
To: MARVELL ASIA PTE, LTD.
Reel/Frame 053988/0195 →