Patent Assignment
Reel/Frame 050817/0356
Assignment of Assignor's Interest
Recorded: 2019-10-24
Pages: 4
Assignor
MATSUDA, SHUHEI
Executed: 2019-06-14
Assignee
SUMCO CORPORATION
2-1, SHIBAURA 1-CHOME, MINATO-KU, TOKYO, 1058634, JAPAN
Covered Property
(1)
Method of Polishing Silicon Wafer